Hardware

Moves to CDNA 5 on 2nm and HBM4, with four times the MI355X’s peak 4-bit compute and nearly three times its bandwidth.

An MI400 Series GPU that keeps full hardware FP64 for supercomputers alongside 4-bit AI compute.

CDNA 4 on 3nm with new MXFP4 and MXFP6 formats and 288 GB of HBM3E.

Liquid-cooled CDNA 4 part at higher clocks than the MI350X, with MXFP4 and MXFP6 and 8 TB/s.

Puts MI350 silicon on an air-cooled PCIe card for existing enterprise servers, at half the MI355X’s compute and memory.

AMD’s first CDNA 3 GPU, adding FP8 and sparsity and 192 GB of HBM3 for large language model work.

Merges CPU and GPU on one package with shared HBM3.

Same CDNA 3 compute as the MI300X with HBM3E, raising memory to 256 GB and bandwidth to 6 TB/s.

Broadcom’s 102.4 Tbps Ethernet switch, the networking silicon that ties large AI clusters together.