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MediaTek

MediaTek ships more mobile processors by unit than anyone, largely because it supplies the mid-range where most of the world actually buys phones. Its NPU is therefore one of the most numerous AI accelerators in existence, and one of the least discussed.

It publishes no TOPS figures. The 100 TOPS number attached to the Dimensity 9500 across dozens of articles traces back to Counterpoint Research, not to MediaTek.

Its more interesting role in 2026 is as a co-designer. MediaTek is reported to work alongside Broadcom on parts of Google’s TPU programme — a reminder that the companies whose names appear on AI chips are frequently not the only ones designing them.

Silicon from MediaTek

3 chips on record, newest first.

  1. 2025

    MediaTek Dimensity 9500

    TSMC N3P NPU 990 with Generative AI Engine 2.0, plus a separate compute-in-memory always-on NPU

    2x compute; 100% faster 3B-parameter LLM output; 128K-token on-device context; BitNet 1.58-bit support

    Relative only
  2. 2024

    MediaTek Dimensity 9400

    Second-generation TSMC 3nm NPU 890

    Up to 80% faster LLM prompt performance and up to 35% more power efficient than Dimensity 9300

    Relative only
  3. 2023

    MediaTek Dimensity 9300

    Third-generation TSMC 4nm APU 790

    8x faster than the previous generation for Transformer models; supports LLMs at 1B, 7B and 13B parameters, scalable to 33B

    Relative only

Compare against every other vendor in the silicon tracker